Kumatshini wokudibana kwetekhnoloji yehlabathi, umzi-mveliso we-semicondcuctor ufikelele kwimida yenkqubo yokucofa, ukuphazamisa iimfuno ezintsha kunye nezinto ezintsha kwitekhnoloji yokupakisha.Eli nqaku liza kuphanga ngokunzulu ukuba ii-chips zasekhaya zinokufumana njani iitekhnoloji zezobuchwephesha ngetekhnoloji yokuhamba phantsi kwetekhnoloji yokunqongophala koomatshini bokungabikho kwe-EUVOGY.
1. Utshintsho olutsha kumzi-mveliso we-semicondcuctor: Ukupakisha okuphambili kuba sisitshixo
Kwiminyaka yakutshanje, kunye nokukhulisa itekhnoloji ye-semicondcuctorctor yendlela, sasondela kumda womzimba.Kulo mzuzu ubalulekileyo, itekhnoloji yokupakisha ephambili ivelisiwe njengoko amaxesha afuna kwaye waba yindawo entsha yedabi ukukhuthaza ukuphuculwa kweNtsebenzo ye-CCP.Ukwahluka kwixabiso elongeziweyo kunye nenkcitho ephezulu yephakheji yemveli, itekhnoloji yokupakisha ephathekayo efana ne-cowos sele iqalile ukufumana ingqalelo ebanzi kwishishini.Xa imfuneko ye-AI ye-AI igoduka i-AIRS, ingakumbi kumdyarho weengalo ze-AI ekhokelwa ngu Nvidds, amandla emveliso eqinileyo ye-tsmc sele evele, enyanzelisa ukuphuculwa kwetekhnoloji yokupakisha.
Kwangelo xesha, nangona i-TSMC, njengenkokeli yeshishini, isekwindawo ekhokelayo kwicandelo lokubhalwa kwezinto, ebusweni bokukhula okuqhushumbayo kwimfuno ye-AI, kunye ne-gials yeshishiniWaziva uxinzelelo olungathethekiyo lwaza lwaza lwaza lwandiswa ngenyameko
2. Ukulinganiselwa kwemida yobugcisa kunye nokuqhekeka: Ukusuka kwi-Microprocecececececeng yokupakisha
Ukuphuhliswa kwetekhnoloji ye-semiconductor bekusoloko kungumceli mngeni rhoqo kwimida ye-shrinkage.Nangona kunjalo, ukuqala kwinkqubo ye-28NM, isibonelelo esijongene sesomda kwi-shrinkage nganye ngokuthe ngcembe sancipha kwaye iindleko zanda kakhulu, inyanzelisa ishishini le-chip ukuze lifune indlela entsha yophuhliso.Kwangelo xesha, ingxaki ephantsi ye-chips enkulu ye-chips enkulu ikwaba nomnye umqobo omkhulu ukuthintela ukuphuculwa kwentsebenzo.Ingakumbi kwicandelo le-AI, imfuno yee-chips ezisebenzayo ikhuthaze ukufuna izivuno eziphezulu kunye neetshipsi ezinkulu.
Kwimeko yetekhnoloji ye-Microminiture ye-Microminiture edibana nebhotile, itekhnoloji yokupakisha i-Advalfaction ifana ne-ray yokukhanya, ukubonelela ngesikhokelo sophuhliso olutsha kwishishini.Ukupakishwa okuphucukileyo akuphuculi nje ukudityaniswa kunye nokusebenza kweetshipsi, kodwa nangokufanelekileyo kusombulula inguquzelo yeengxaki ekupakishwe ngokwesiko, ukutshintsha impumelelo, njl njl.
3. Ukujonga kwikamva: Ukufumanisa iimfihlakalo zokupakishwa phambili
Njengoko ubuchwepheshe beTekhnoloji yeHlabathi bujoyine kuphando kunye nophuhliso kunye nokusetyenziswa kwetekhnoloji yokupakisha, ishishini lokupakisha linikezele ngamathuba amatsha ophuhliso.Ishishini lokupakisha, elisetyenziselwa ukuba lithathwe njengekhonkco lesibini, ngoku lingumntu ophambili ekukhuthazeni ukuqhubela phambili kwetekhnoloji ye-semicondcuct.Isikali soShishino lwePakeji yeHlabathi yeHlabathi yePakethi yawondla unyaka nonyaka, kunye netekhnoloji iyatshintsha ngawo uSuku ngalunye oludlulayo.Ukusuka kwi-FC, i-SIP ukuya kwi-3D ukupakisha, yonke itekhnoloji entsha ityhala yonke imizi-mveliso ye-semicondcuctor phambili.
Ukujamelana nekamva, ukuphuculwa kwetekhnoloji yokupakisha kuya kwahluka kwaye kunzima.Ngokuzalwa nokusetyenziswa kwetekhnoloji yokuphindaphinda, ukupakisha okhethekileyo akuyi kuba yindlela yokoyisa iibhotile zobuchwephesha, kodwa kwanenjini ebalulekileyo ekukhuthazeni ubuchule obuqhubekayo kunye nophuhliso lwecandelo le-jimicondcuctor.Sinesizathu sokukholelwa ukuba itekhnoloji yokupakisha ephathekayo iya kuqhubeka nokudlala indima ebalulekileyo kwiteknoloji yeTekhnoloji yeHlabathi.